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"Wafer-level 3D integration using hybrid bonding."

Cheng-Ta Ko et al. (2010)

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DOI: 10.1109/3DIC.2010.5751463

access: closed

type: Conference or Workshop Paper

metadata version: 2017-09-16

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  - conf/3dic/KoCLCHHFC10
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  - https://dblp.org/rec/conf/3dic/KoCLCHHFC10
Cheng-Ta Ko, Kuan-Neng Chen, Wei-Chung Lo, Chuan-An Cheng, Wen-Chun Huang, Zhi-Cheng Hsiao, Huan-Chun Fu, Yu-Hua Chen:
Wafer-level 3D integration using hybrid bonding. 3DIC 2010: 1-4

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