BibTeX record conf/3dic/JouveHBDPBDH09

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@inproceedings{DBLP:conf/3dic/JouveHBDPBDH09,
  author    = {Amadine Jouve and
               Wenbin Hong and
               D. Blumenshine and
               JoElle Dachsteiner and
               Rama Puligadda and
               Dongshun Bai and
               J. Diaz and
               David Henry},
  title     = {Material improvement for ultrathin-wafer handling in {TSV} creation
               and {PECVD} process},
  booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
               San Francisco, California, USA, 28-30 September 2009},
  pages     = {1--5},
  publisher = {{IEEE}},
  year      = {2009},
  url       = {https://doi.org/10.1109/3DIC.2009.5306523},
  doi       = {10.1109/3DIC.2009.5306523},
  timestamp = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl    = {https://dblp.org/rec/conf/3dic/JouveHBDPBDH09.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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