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"Surface passivation of Cu cone bump by self-assembled-monolayer for room ..."
Akihiro Ikeda et al. (2013)
- Akihiro Ikeda, L. J. Qiu, K. Nakahara, Tanemasa Asano:
Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding. 3DIC 2013: 1-4
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