"Continuity and reliability assessment of a scalable 3×50μm and ..."

Stefaan Van Huylenbroeck et al. (2016)

> Home

Details and statistics

DOI: 10.1109/3DIC.2016.7970001

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/3dic/HuylenbroeckLSB16
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/HuylenbroeckLSB16
Stefaan Van Huylenbroeck, Yunlong Li, Michele Stucchi, Lieve Bogaerts, Joeri De Vos, Gerald Beyer, Eric Beyne, Mohand Brouri, Praveen Nalla, Sanjay Gopinath, Matthew Thorum, Joe Richardson, Jengyi Yu:
Continuity and reliability assessment of a scalable 3×50μm and 2×40μm via-middle TSV module. 3DIC 2016: 1-4

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.