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"Continuity and reliability assessment of a scalable 3×50μm and ..."

Stefaan Van Huylenbroeck et al. (2016)

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DOI: 10.1109/3DIC.2016.7970001

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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Stefaan Van Huylenbroeck, Yunlong Li, Michele Stucchi, Lieve Bogaerts, Joeri De Vos, Gerald Beyer, Eric Beyne, Mohand Brouri, Praveen Nalla, Sanjay Gopinath, Matthew Thorum, Joe Richardson, Jengyi Yu:
Continuity and reliability assessment of a scalable 3×50μm and 2×40μm via-middle TSV module. 3DIC 2016: 1-4

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