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"Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding ..."

Liangxing Hu et al. (2021)

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DOI: 10.1109/3DIC52383.2021.9687609

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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  - conf/3dic/HuGLZLT21
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Liangxing Hu, Simon Chun Kiat Goh, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Chuan Seng Tan:
Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions. 3DIC 2021: 1-5

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