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"Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed ..."

Masahide Goto et al. (2019)

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DOI: 10.1109/3DIC48104.2019.9058785

access: closed

type: Conference or Workshop Paper

metadata version: 2024-05-07

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  - conf/3dic/GotoVWHNIHHSKTH19
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  - https://dblp.org/rec/conf/3dic/GotoVWHNIHHSKTH19
Masahide Goto, Joeri De Vos, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi, Eiji Higurashi, Yuki Honda, Takuya Saraya, Masaharu Kobayashi, Hiroshi Toshiyoshi, Toshiro Hiramoto:
Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed by Hybrid Bonding of SOI Wafers. 3DIC 2019: 1-4

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