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"Integration of CNT in TSV (≤5 μm) for 3D IC application and its ..."

Kaushik Ghosh et al. (2013)

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DOI: 10.1109/3DIC.2013.6702369

access: closed

type: Conference or Workshop Paper

metadata version: 2022-01-20

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  - conf/3dic/GhoshYTT13
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Kaushik Ghosh, C. C. Yap, Beng Kang Tay, Chuan Seng Tan:
Integration of CNT in TSV (≤5 μm) for 3D IC application and its process challenges. 3DIC 2013: 1-4

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