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"Development of via-last 3D integration technologies using a new temporary ..."

Takafumi Fukushima et al. (2013)

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DOI: 10.1109/3DIC.2013.6702383

access: closed

type: Conference or Workshop Paper

metadata version: 2021-02-16

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Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Mitsumasa Koyanagi:
Development of via-last 3D integration technologies using a new temporary adhesive system. 3DIC 2013: 1-4

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