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"3-D thin chip integration technology - from technology development to ..."

Thomas Fritzsch et al. (2009)

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DOI: 10.1109/3DIC.2009.5306578

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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Thomas Fritzsch, Raul Mrossko, Tobias Baumgartner, Michael Toepper, Matthias Klein, Jürgen Wolf, Bernhard Wunderle, Herbert Reichl:
3-D thin chip integration technology - from technology development to application. 3DIC 2009: 1-8

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