"A successful implementation of dual damascene architecture to copper TSV ..."

Rebha El Farhane et al. (2010)

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DOI: 10.1109/3DIC.2010.5751445

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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Rebha El Farhane, Myriam Assous, Patrick Leduc, Aurélie Thuaire, David Bouchu, Hélène Feldis, Nicolas Sillon:
A successful implementation of dual damascene architecture to copper TSV for 3D high density applications. 3DIC 2010: 1-4

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