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"Use of optical metrology for wafer level packaging of CMOS image sensor."

D. Le Cunff et al. (2010)

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DOI: 10.1109/3DIC.2010.5751473

access: closed

type: Conference or Workshop Paper

metadata version: 2023-06-06

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  - https://dblp.org/rec/conf/3dic/CunffPCEDC10
D. Le Cunff, A. Pravdivtsev, K. Le Chao, C. Euvrard, Emilie Deloffre, A. Cailean:
Use of optical metrology for wafer level packaging of CMOS image sensor. 3DIC 2010: 1-6

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