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"200°C direct bonding copper interconnects : Electrical results and ..."

Léa Di Cioccio et al. (2011)

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DOI: 10.1109/3DIC.2012.6262976

access: closed

type: Conference or Workshop Paper

metadata version: 2019-07-16

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Léa Di Cioccio, Rachid Taibi, Cédrick Chappaz, Stéphane Moreau, Laurent-Luc Chapelon, Thomas Signamarcheix:
200°C direct bonding copper interconnects : Electrical results and reliability. 3DIC 2011: 1-4

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