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"Wafer-scale 3D integration of InGaAs image sensors with Si readout circuits."

Chang-Lee Chen et al. (2009)

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DOI: 10.1109/3DIC.2009.5306556

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  - conf/3dic/ChenYKCOMDSSBBHWKS09
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  - https://dblp.org/rec/conf/3dic/ChenYKCOMDSSBBHWKS09
Chang-Lee Chen, D.-R. Yost, Jeffrey M. Knecht, David C. Chapman, Douglas C. Oakley, Leonard J. Mahoney, Joseph P. Donnelly, Antonio M. Soares, Vyshnavi Suntharalingam, Robert Berger, V. Bolkhovsky, W. Hu, Bruce D. Wheeler, Craig L. Keast, David C. Shaver:
Wafer-scale 3D integration of InGaAs image sensors with Si readout circuits. 3DIC 2009: 1-4

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