"Modelling of Through Silicon Via RF performance and impact on signal ..."

Lionel Cadix et al. (2009)

> Home

Details and statistics

DOI: 10.1109/3DIC.2009.5306592

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/3dic/CadixFBFLRAVRESFA09
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/CadixFBFLRAVRESFA09
Lionel Cadix, Alexis Farcy, Cédric Bermond, Christine Fuchs, Patrick Leduc, Maxime Rousseau, Myriam Assous, Alexandre Valentian, Julie Roullard, Elie Eid, Nicolas Sillon, Bernard Fléchet, Pascal Ancey:
Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits. 3DIC 2009: 1-7

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.