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"Electrical, thermal and mechanical impact of 3D TSV and 3D stacking ..."

Eric Beyne (2011)

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DOI: 10.1109/3DIC.2012.6262977

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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Eric Beyne:
Electrical, thermal and mechanical impact of 3D TSV and 3D stacking technology on advanced CMOS devices - Technology directions. 3DIC 2011: 1-6

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