BibTeX record journals/tvlsi/ChiMGW14

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@article{DBLP:journals/tvlsi/ChiMGW14,
  author    = {Chun{-}Chuan Chi and
               Erik Jan Marinissen and
               Sandeep Kumar Goel and
               Cheng{-}Wen Wu},
  title     = {Low-Cost Post-Bond Testing of 3-D ICs Containing a Passive Silicon
               Interposer Base},
  journal   = {{IEEE} Trans. Very Large Scale Integr. Syst.},
  volume    = {22},
  number    = {11},
  pages     = {2388--2401},
  year      = {2014},
  url       = {https://doi.org/10.1109/TVLSI.2013.2293192},
  doi       = {10.1109/TVLSI.2013.2293192},
  timestamp = {Wed, 11 Mar 2020 18:18:56 +0100},
  biburl    = {https://dblp.org/rec/journals/tvlsi/ChiMGW14.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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