BibTeX record journals/tcad/PakLP14

download as .bib file

@article{DBLP:journals/tcad/PakLP14,
  author       = {Jiwoo Pak and
                  Sung Kyu Lim and
                  David Z. Pan},
  title        = {Electromigration Study for Multiscale Power/Ground Vias in TSV-Based
                  3-D ICs},
  journal      = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.},
  volume       = {33},
  number       = {12},
  pages        = {1873--1885},
  year         = {2014},
  url          = {https://doi.org/10.1109/TCAD.2014.2360456},
  doi          = {10.1109/TCAD.2014.2360456},
  timestamp    = {Sun, 02 Oct 2022 15:50:16 +0200},
  biburl       = {https://dblp.org/rec/journals/tcad/PakLP14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.