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BibTeX record journals/tcad/JungMPL12
@article{DBLP:journals/tcad/JungMPL12, author = {Moongon Jung and Joydeep Mitra and David Z. Pan and Sung Kyu Lim}, title = {{TSV} Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3-D {IC}}, journal = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.}, volume = {31}, number = {8}, pages = {1194--1207}, year = {2012}, url = {https://doi.org/10.1109/TCAD.2012.2188400}, doi = {10.1109/TCAD.2012.2188400}, timestamp = {Sun, 02 Oct 2022 15:50:16 +0200}, biburl = {https://dblp.org/rec/journals/tcad/JungMPL12.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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