BibTeX record journals/mr/ZaalHDZ09

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@article{DBLP:journals/mr/ZaalHDZ09,
  author       = {Jeroen J. M. Zaal and
                  Hendrik Pieter Hochstenbach and
                  Willem D. van Driel and
                  G. Q. Zhang},
  title        = {Solder interconnect reliability under drop impact loading conditions
                  using High-speed Cold Bump Pull},
  journal      = {Microelectron. Reliab.},
  volume       = {49},
  number       = {8},
  pages        = {846--852},
  year         = {2009},
  url          = {https://doi.org/10.1016/j.microrel.2009.03.008},
  doi          = {10.1016/J.MICROREL.2009.03.008},
  timestamp    = {Sat, 22 Feb 2020 19:28:17 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ZaalHDZ09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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