BibTeX record journals/mr/YangSL14

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@article{DBLP:journals/mr/YangSL14,
  author       = {Chaoran Yang and
                  Fubin Song and
                  S. W. Ricky Lee},
  title        = {Impact of Ni concentration on the intermetallic compound formation
                  and brittle fracture strength of Sn-Cu-Ni {(SCN)} lead-free solder
                  joints},
  journal      = {Microelectron. Reliab.},
  volume       = {54},
  number       = {2},
  pages        = {435--446},
  year         = {2014},
  url          = {https://doi.org/10.1016/j.microrel.2013.10.005},
  doi          = {10.1016/J.MICROREL.2013.10.005},
  timestamp    = {Thu, 14 Oct 2021 09:38:44 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/YangSL14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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