BibTeX record journals/mr/TangCC12

download as .bib file

@article{DBLP:journals/mr/TangCC12,
  author    = {Ya{-}Sheng Tang and
               Yao{-}Jen Chang and
               Kuan{-}Neng Chen},
  title     = {Wafer-level Cu-Cu bonding technology},
  journal   = {Microelectronics Reliability},
  volume    = {52},
  number    = {2},
  pages     = {312--320},
  year      = {2012},
  url       = {https://doi.org/10.1016/j.microrel.2011.04.016},
  doi       = {10.1016/j.microrel.2011.04.016},
  timestamp = {Sat, 16 Sep 2017 12:06:03 +0200},
  biburl    = {https://dblp.org/rec/bib/journals/mr/TangCC12},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
a service of Schloss Dagstuhl - Leibniz Center for Informatics