BibTeX record journals/mr/TanLAWL12

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@article{DBLP:journals/mr/TanLAWL12,
  author       = {Chuan Seng Tan and
                  Dau Fatt Lim and
                  Xiao Fang Ang and
                  J. Wei and
                  K. C. Leong},
  title        = {Low temperature Cu-Cu thermo-compression bonding with temporary passivation
                  of self-assembled monolayer and its bond strength enhancement},
  journal      = {Microelectron. Reliab.},
  volume       = {52},
  number       = {2},
  pages        = {321--324},
  year         = {2012},
  url          = {https://doi.org/10.1016/j.microrel.2011.04.003},
  doi          = {10.1016/J.MICROREL.2011.04.003},
  timestamp    = {Sun, 31 Oct 2021 18:20:18 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/TanLAWL12.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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