BibTeX record journals/mr/OngALOC13

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@article{DBLP:journals/mr/OngALOC13,
  author       = {Ernest E. S. Ong and
                  Mohd Zulkifly Abdullah and
                  W. K. Loh and
                  C. K. Ooi and
                  R. Chan},
  title        = {{FSI} implications of {EMC} rheological properties to 3D {IC} with
                  {TSV} structures during plastic encapsulation process},
  journal      = {Microelectron. Reliab.},
  volume       = {53},
  number       = {4},
  pages        = {600--611},
  year         = {2013},
  url          = {https://doi.org/10.1016/j.microrel.2012.10.015},
  doi          = {10.1016/J.MICROREL.2012.10.015},
  timestamp    = {Sat, 21 May 2022 20:37:53 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/OngALOC13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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