BibTeX record journals/mr/MaYW14

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@article{DBLP:journals/mr/MaYW14,
  author       = {He Ma and
                  Daquan Yu and
                  Jun Wang},
  title        = {The development of effective model for thermal conduction analysis
                  for 2.5D packaging using {TSV} interposer},
  journal      = {Microelectron. Reliab.},
  volume       = {54},
  number       = {2},
  pages        = {425--434},
  year         = {2014},
  url          = {https://doi.org/10.1016/j.microrel.2013.10.003},
  doi          = {10.1016/J.MICROREL.2013.10.003},
  timestamp    = {Sat, 22 Feb 2020 19:26:52 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/MaYW14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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