BibTeX record journals/mr/LofranoCGB18

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@article{DBLP:journals/mr/LofranoCGB18,
  author    = {Melina Lofrano and
               Vladimir Cherman and
               Mario Gonzalez and
               Eric Beyne},
  title     = {Enhanced Cu pillar design to reduce thermomechanical stress induced
               during flip chip assembly},
  journal   = {Microelectron. Reliab.},
  volume    = {87},
  pages     = {97--105},
  year      = {2018},
  url       = {https://doi.org/10.1016/j.microrel.2018.06.004},
  doi       = {10.1016/j.microrel.2018.06.004},
  timestamp = {Sat, 22 Feb 2020 19:27:06 +0100},
  biburl    = {https://dblp.org/rec/journals/mr/LofranoCGB18.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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