BibTeX record journals/mr/KwonBJB15

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@article{DBLP:journals/mr/KwonBJB15,
  author       = {YongHyuk Kwon and
                  HeeSeon Bang and
                  Sungmin Joo and
                  HanSur Bang},
  title        = {Numerical analysis of thermo-mechanical characteristics of solder
                  joint depending on change in solder junction structure of {MCP}},
  journal      = {Microelectron. Reliab.},
  volume       = {55},
  number       = {2},
  pages        = {442--447},
  year         = {2015},
  url          = {https://doi.org/10.1016/j.microrel.2014.11.005},
  doi          = {10.1016/J.MICROREL.2014.11.005},
  timestamp    = {Sat, 22 Feb 2020 19:28:33 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/KwonBJB15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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