BibTeX record journals/mr/KungCL13

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@article{DBLP:journals/mr/KungCL13,
  author       = {Huang{-}Kuang Kung and
                  Hung{-}Shyong Chen and
                  Ming{-}Cheng Lu},
  title        = {The wire sag problem in wire bonding technology for semiconductor
                  packaging},
  journal      = {Microelectron. Reliab.},
  volume       = {53},
  number       = {2},
  pages        = {288--296},
  year         = {2013},
  url          = {https://doi.org/10.1016/j.microrel.2012.08.017},
  doi          = {10.1016/J.MICROREL.2012.08.017},
  timestamp    = {Sat, 22 Feb 2020 19:27:37 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/KungCL13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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