BibTeX record journals/mr/KuanLC09

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@article{DBLP:journals/mr/KuanLC09,
  author       = {Wei{-}Chih Kuan and
                  S. W. Liang and
                  Chih Chen},
  title        = {Effect of bump size on current density and temperature distributions
                  in flip-chip solder joints},
  journal      = {Microelectron. Reliab.},
  volume       = {49},
  number       = {5},
  pages        = {544--550},
  year         = {2009},
  url          = {https://doi.org/10.1016/j.microrel.2009.03.001},
  doi          = {10.1016/J.MICROREL.2009.03.001},
  timestamp    = {Sat, 22 Feb 2020 19:28:51 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/KuanLC09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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