BibTeX record journals/mr/KraemerRMAMW18

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@article{DBLP:journals/mr/KraemerRMAMW18,
  author       = {Frank Kraemer and
                  Mike Roellig and
                  Ren{\'{e}} Metasch and
                  Joseph Al Ahmar and
                  Karsten Meier and
                  Steffen Wiese},
  title        = {Experimental determination of the Young's modulus of copper and solder
                  materials for electronic packaging},
  journal      = {Microelectron. Reliab.},
  volume       = {91},
  pages        = {251--256},
  year         = {2018},
  url          = {https://doi.org/10.1016/j.microrel.2018.06.002},
  doi          = {10.1016/J.MICROREL.2018.06.002},
  timestamp    = {Sun, 02 Oct 2022 15:44:01 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/KraemerRMAMW18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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