BibTeX record journals/mr/KimRYK05

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@article{DBLP:journals/mr/KimRYK05,
  author       = {Kyung{-}Seob Kim and
                  K. W. Ryu and
                  C. H. Yu and
                  J. M. Kim},
  title        = {The formation and growth of intermetallic compounds and shear strength
                  at Sn-Zn solder/Au-Ni-Cu interfaces},
  journal      = {Microelectron. Reliab.},
  volume       = {45},
  number       = {3-4},
  pages        = {647--655},
  year         = {2005},
  url          = {https://doi.org/10.1016/j.microrel.2004.07.005},
  doi          = {10.1016/J.MICROREL.2004.07.005},
  timestamp    = {Thu, 31 Aug 2023 16:23:36 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/KimRYK05.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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