BibTeX record journals/mr/JiWL16

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@article{DBLP:journals/mr/JiWL16,
  author       = {Hongjun Ji and
                  Jiao Wang and
                  Mingyu Li},
  title        = {Microstructure and reliability of hybrid interconnects by Au stud
                  bump with Sn-0.7Cu solder for flip chip power device packaging},
  journal      = {Microelectron. Reliab.},
  volume       = {66},
  pages        = {134--142},
  year         = {2016},
  url          = {https://doi.org/10.1016/j.microrel.2016.10.003},
  doi          = {10.1016/J.MICROREL.2016.10.003},
  timestamp    = {Sat, 22 Feb 2020 19:27:25 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/JiWL16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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