BibTeX record journals/mr/HaqueSCWLBL01

download as .bib file

@article{DBLP:journals/mr/HaqueSCWLBL01,
  author       = {Shatil Haque and
                  Kalyan Siddabattula and
                  Mike Craven and
                  Sihua Wen and
                  Xingsheng Liu and
                  Dushan Boroyevich and
                  Guo{-}Quan Lu},
  title        = {Design issues of a three-dimensional packaging scheme for power modules},
  journal      = {Microelectron. Reliab.},
  volume       = {41},
  number       = {2},
  pages        = {295--305},
  year         = {2001},
  url          = {https://doi.org/10.1016/S0026-2714(00)00208-0},
  doi          = {10.1016/S0026-2714(00)00208-0},
  timestamp    = {Sun, 12 Nov 2023 02:18:55 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/HaqueSCWLBL01.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.