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BibTeX record journals/mr/FanWHWL16
@article{DBLP:journals/mr/FanWHWL16, author = {Mengying Fan and Li Wei and Zhenzhi He and Wei Wei and Xiangning Lu}, title = {Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy {SVM} algorithm}, journal = {Microelectron. Reliab.}, volume = {65}, pages = {192--197}, year = {2016}, url = {https://doi.org/10.1016/j.microrel.2016.08.010}, doi = {10.1016/J.MICROREL.2016.08.010}, timestamp = {Sat, 22 Feb 2020 19:29:27 +0100}, biburl = {https://dblp.org/rec/journals/mr/FanWHWL16.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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