BibTeX record journals/mr/DingYCWSD14

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@article{DBLP:journals/mr/DingYCWSD14,
  author       = {Yingtao Ding and
                  Yangyang Yan and
                  Qianwen Chen and
                  Shiwei Wang and
                  Rui Su and
                  Hua Dang},
  title        = {Analytical solution on interfacial reliability of 3-D through-silicon-via
                  {(TSV)} containing dielectric liner},
  journal      = {Microelectron. Reliab.},
  volume       = {54},
  number       = {6-7},
  pages        = {1384--1391},
  year         = {2014},
  url          = {https://doi.org/10.1016/j.microrel.2014.02.030},
  doi          = {10.1016/J.MICROREL.2014.02.030},
  timestamp    = {Sat, 22 Feb 2020 19:28:07 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/DingYCWSD14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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