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BibTeX record journals/mr/DanduFLD10
@article{DBLP:journals/mr/DanduFLD10, author = {Pridhvi Dandu and Xuejun Fan and Y. Liu and C. Diao}, title = {Finite element modeling on electromigration of solder joints in wafer level packages}, journal = {Microelectron. Reliab.}, volume = {50}, number = {4}, pages = {547--555}, year = {2010}, url = {https://doi.org/10.1016/j.microrel.2009.12.003}, doi = {10.1016/J.MICROREL.2009.12.003}, timestamp = {Thu, 23 Jun 2022 20:05:03 +0200}, biburl = {https://dblp.org/rec/journals/mr/DanduFLD10.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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