BibTeX record journals/mr/ChenCYK13

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@article{DBLP:journals/mr/ChenCYK13,
  author       = {Y. J. Chen and
                  C. K. Chung and
                  C. R. Yang and
                  C. Robert Kao},
  title        = {Single-joint shear strength of micro Cu pillar solder bumps with different
                  amounts of intermetallics},
  journal      = {Microelectron. Reliab.},
  volume       = {53},
  number       = {1},
  pages        = {47--52},
  year         = {2013},
  url          = {https://doi.org/10.1016/j.microrel.2012.06.116},
  doi          = {10.1016/J.MICROREL.2012.06.116},
  timestamp    = {Sat, 22 Feb 2020 19:28:37 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ChenCYK13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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