BibTeX record journals/mr/AuerspergDJBRM14

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@article{DBLP:journals/mr/AuerspergDJBRM14,
  author       = {J{\"{u}}rgen Auersperg and
                  Rainer Dudek and
                  R. Jordan and
                  O. Bochow{-}Ne{\ss} and
                  Sven Rzepka and
                  Bernd Michel},
  title        = {On the crack and delamination risk optimization of a Si-interposer
                  for {LED} packaging},
  journal      = {Microelectron. Reliab.},
  volume       = {54},
  number       = {6-7},
  pages        = {1223--1227},
  year         = {2014},
  url          = {https://doi.org/10.1016/j.microrel.2014.02.018},
  doi          = {10.1016/J.MICROREL.2014.02.018},
  timestamp    = {Sun, 02 Oct 2022 15:43:59 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/AuerspergDJBRM14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}