BibTeX record journals/micromachines/FukushimaHYKMBL16

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@article{DBLP:journals/micromachines/FukushimaHYKMBL16,
  author    = {Takafumi Fukushima and
               Hideto Hashiguchi and
               Hiroshi Yonekura and
               Hisashi Kino and
               Mariappan Murugesan and
               Ji Chel Bea and
               Kang Wook Lee and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary
               Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration},
  journal   = {Micromachines},
  volume    = {7},
  number    = {10},
  pages     = {184},
  year      = {2016},
  url       = {https://doi.org/10.3390/mi7100184},
  doi       = {10.3390/mi7100184},
  timestamp = {Tue, 14 Aug 2018 11:56:08 +0200},
  biburl    = {https://dblp.org/rec/bib/journals/micromachines/FukushimaHYKMBL16},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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