BibTeX record journals/ieicet/HigurashiOKSH17

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@article{DBLP:journals/ieicet/HigurashiOKSH17,
  author       = {Eiji Higurashi and
                  Ken Okumura and
                  Yutaka Kunimune and
                  Tadatomo Suga and
                  Kei Hagiwara},
  title        = {Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient
                  Air Using a Surface-Activated Bonding Method},
  journal      = {{IEICE} Trans. Electron.},
  volume       = {100-C},
  number       = {2},
  pages        = {156--160},
  year         = {2017},
  url          = {https://doi.org/10.1587/transele.E100.C.156},
  doi          = {10.1587/TRANSELE.E100.C.156},
  timestamp    = {Mon, 15 Jun 2020 16:50:44 +0200},
  biburl       = {https://dblp.org/rec/journals/ieicet/HigurashiOKSH17.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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