BibTeX record conf/itc/ChiMGW11

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@inproceedings{DBLP:conf/itc/ChiMGW11,
  author    = {Chun{-}Chuan Chi and
               Erik Jan Marinissen and
               Sandeep Kumar Goel and
               Cheng{-}Wen Wu},
  editor    = {Bill Eklow and
               R. D. (Shawn) Blanton},
  title     = {Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon
               interposer base},
  booktitle = {2011 {IEEE} International Test Conference, {ITC} 2011, Anaheim, CA,
               USA, September 20-22, 2011},
  pages     = {1--10},
  publisher = {{IEEE} Computer Society},
  year      = {2011},
  url       = {https://doi.org/10.1109/TEST.2011.6139181},
  doi       = {10.1109/TEST.2011.6139181},
  timestamp = {Wed, 16 Oct 2019 14:14:52 +0200},
  biburl    = {https://dblp.org/rec/conf/itc/ChiMGW11.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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