BibTeX record conf/isqed/LeeDP17

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@inproceedings{DBLP:conf/isqed/LeeDP17,
  author       = {Dongjin Lee and
                  Sourav Das and
                  Partha Pratim Pande},
  title        = {Performance-thermal trade-offs for a VFI-enabled 3D NoC architecture},
  booktitle    = {18th International Symposium on Quality Electronic Design, {ISQED}
                  2017, Santa Clara, CA, USA, March 14-15, 2017},
  pages        = {271--276},
  publisher    = {{IEEE}},
  year         = {2017},
  url          = {https://doi.org/10.1109/ISQED.2017.7918327},
  doi          = {10.1109/ISQED.2017.7918327},
  timestamp    = {Wed, 16 Oct 2019 14:14:55 +0200},
  biburl       = {https://dblp.org/rec/conf/isqed/LeeDP17.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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