BibTeX record conf/isocc/HanLKK17

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@inproceedings{DBLP:conf/isocc/HanLKK17,
  author       = {Donghyun Han and
                  Hayoung Lee and
                  Donghyun Kim and
                  Sungho Kang},
  title        = {A new repair scheme for TSV-based 3D memory using base die repair
                  cells},
  booktitle    = {International SoC Design Conference, {ISOCC} 2017, Seoul, South Korea,
                  November 5-8, 2017},
  pages        = {11--12},
  publisher    = {{IEEE}},
  year         = {2017},
  url          = {https://doi.org/10.1109/ISOCC.2017.8368804},
  doi          = {10.1109/ISOCC.2017.8368804},
  timestamp    = {Tue, 27 Feb 2024 16:41:39 +0100},
  biburl       = {https://dblp.org/rec/conf/isocc/HanLKK17.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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