BibTeX record conf/irps/MitaniHN18

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@inproceedings{DBLP:conf/irps/MitaniHN18,
  author       = {Yuichiro Mitani and
                  Yusuke Higashi and
                  Yasushi Nakasaki},
  title        = {Study on mechanism of thermal curing in ultra-thin gate dielectrics},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2018, Burlingame,
                  CA, USA, March 11-15, 2018},
  pages        = {3},
  publisher    = {{IEEE}},
  year         = {2018},
  url          = {https://doi.org/10.1109/IRPS.2018.8353554},
  doi          = {10.1109/IRPS.2018.8353554},
  timestamp    = {Thu, 14 Oct 2021 10:37:10 +0200},
  biburl       = {https://dblp.org/rec/conf/irps/MitaniHN18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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