BibTeX record conf/irps/LeeBMFTK15

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@inproceedings{DBLP:conf/irps/LeeBMFTK15,
  author    = {Kang Wook Lee and
               Ji Chel Bea and
               Mariappan Murugesan and
               Takafumi Fukushima and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {Impacts of 3-D integration processes on device reliabilities in thinned
               {DRAM} chip for 3-D {DRAM}},
  booktitle = {{IEEE} International Reliability Physics Symposium, {IRPS} 2015, Monterey,
               CA, USA, April 19-23, 2015},
  pages     = {4},
  year      = {2015},
  crossref  = {DBLP:conf/irps/2015},
  url       = {https://doi.org/10.1109/IRPS.2015.7112733},
  doi       = {10.1109/IRPS.2015.7112733},
  timestamp = {Sun, 21 May 2017 00:17:26 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/irps/LeeBMFTK15},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/irps/2015,
  title     = {{IEEE} International Reliability Physics Symposium, {IRPS} 2015, Monterey,
               CA, USA, April 19-23, 2015},
  publisher = {{IEEE}},
  year      = {2015},
  url       = {http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=7106273},
  isbn      = {978-1-4673-7362-3},
  timestamp = {Mon, 07 Mar 2016 09:32:18 +0100},
  biburl    = {https://dblp.org/rec/bib/conf/irps/2015},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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