BibTeX record conf/irps/HuKHMSOCPPASQGB18

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@inproceedings{DBLP:conf/irps/HuKHMSOCPPASQGB18,
  author       = {Chao{-}Kun Hu and
                  James J. Kelly and
                  Huai Huang and
                  Koichi Motoyama and
                  Hosadurga Shobha and
                  Yuri Ostrovski and
                  James H.{-}C. Chen and
                  Raghuveer Patlolla and
                  Brown Peethala and
                  Praneet Adusumilli and
                  Terry A. Spooner and
                  Roger Quon and
                  Lynne M. Gignac and
                  Chris M. Breslin and
                  G. Lian and
                  M. Ali and
                  Jacob Benedict and
                  X. S. Lin and
                  S. Smith and
                  Vimal Kamineni and
                  X. Zhang and
                  Frank Wilhelm Mont and
                  Shariq Siddiqui and
                  Frieder H. Baumann},
  title        = {Future on-chip interconnect metallization and electromigration},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2018, Burlingame,
                  CA, USA, March 11-15, 2018},
  pages        = {4},
  publisher    = {{IEEE}},
  year         = {2018},
  url          = {https://doi.org/10.1109/IRPS.2018.8353597},
  doi          = {10.1109/IRPS.2018.8353597},
  timestamp    = {Fri, 08 Sep 2023 15:33:34 +0200},
  biburl       = {https://dblp.org/rec/conf/irps/HuKHMSOCPPASQGB18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}