BibTeX record conf/icecsys/SantosVR14

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@inproceedings{DBLP:conf/icecsys/SantosVR14,
  author       = {Cristiano Santos and
                  Pascal Vivet and
                  Ricardo Augusto da Luz Reis},
  title        = {Thermal impact of 3D stacking and die thickness: Analysis and characterization
                  of a memory-on-logic 3D circuit},
  booktitle    = {21st {IEEE} International Conference on Electronics, Circuits and
                  Systems, {ICECS} 2014, Marseille, France, December 7-10, 2014},
  pages        = {718--721},
  publisher    = {{IEEE}},
  year         = {2014},
  url          = {https://doi.org/10.1109/ICECS.2014.7050086},
  doi          = {10.1109/ICECS.2014.7050086},
  timestamp    = {Tue, 07 May 2024 20:05:47 +0200},
  biburl       = {https://dblp.org/rec/conf/icecsys/SantosVR14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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