BibTeX record conf/dac/JungMPL11

• > Home > conf/dac/JungMPL11

@inproceedings{DBLP:conf/dac/JungMPL11,
  author       = {Moongon Jung and
                  Joydeep Mitra and
                  David Z. Pan and
                  Sung Kyu Lim},
  editor       = {Leon Stok and
                  Nikil D. Dutt and
                  Soha Hassoun},
  title        = {{TSV} stress-aware full-chip mechanical reliability analysis and optimization
                  for 3D {IC}},
  booktitle    = {Proceedings of the 48th Design Automation Conference, {DAC} 2011,
                  San Diego, California, USA, June 5-10, 2011},
  pages        = {188--193},
  publisher    = {{ACM}},
  year         = {2011},
  url          = {https://doi.org/10.1145/2024724.2024767},
  doi          = {10.1145/2024724.2024767},
  timestamp    = {Sun, 02 Oct 2022 15:58:45 +0200},
  biburl       = {https://dblp.org/rec/conf/dac/JungMPL11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}