BibTeX record conf/3dic/ZhangLA13

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@inproceedings{DBLP:conf/3dic/ZhangLA13,
  author    = {Bei Zhang and
               Baohu Li and
               Vishwani D. Agrawal},
  title     = {Yield analysis of a novel wafer manipulation method in 3D stacking},
  booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
               San Francisco, CA, USA, October 2-4, 2013},
  pages     = {1--8},
  year      = {2013},
  crossref  = {DBLP:conf/3dic/2013},
  url       = {https://doi.org/10.1109/3DIC.2013.6702370},
  doi       = {10.1109/3DIC.2013.6702370},
  timestamp = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/ZhangLA13},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/3dic/2013,
  title     = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
               San Francisco, CA, USA, October 2-4, 2013},
  publisher = {{IEEE}},
  year      = {2013},
  url       = {https://ieeexplore.ieee.org/xpl/conhome/6690582/proceeding},
  isbn      = {978-1-4673-6484-3},
  timestamp = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/2013},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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