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BibTeX record conf/3dic/WatanabeMAY11
@inproceedings{DBLP:conf/3dic/WatanabeMAY11, author = {Naoya Watanabe and Takumi Miyazaki and Masahiro Aoyagi and Kazuhiro Yoshikawa}, editor = {Mitsumasa Koyanagi and Morihiro Kada}, title = {Damage evaluation of wet-chemical silicon-wafer thinning process}, booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012}, pages = {1--4}, publisher = {{IEEE}}, year = {2011}, url = {https://doi.org/10.1109/3DIC.2012.6262973}, doi = {10.1109/3DIC.2012.6262973}, timestamp = {Wed, 16 Oct 2019 14:14:50 +0200}, biburl = {https://dblp.org/rec/conf/3dic/WatanabeMAY11.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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