BibTeX record conf/3dic/VickGCT11

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@inproceedings{DBLP:conf/3dic/VickGCT11,
  author       = {Erik Vick and
                  Scott H. Goodwin and
                  Garry Cunnigham and
                  Dorota Temple},
  editor       = {Mitsumasa Koyanagi and
                  Morihiro Kada},
  title        = {Vias-last process technology for thick 2.5D Si interposers},
  booktitle    = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
                  Osaka, Japan, January 31 - February 2, 2012},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2011},
  url          = {https://doi.org/10.1109/3DIC.2012.6262990},
  doi          = {10.1109/3DIC.2012.6262990},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/VickGCT11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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